Siansonic

Ultrasonic Coating of Photoresist for MEMs, Wafers and Other Substrates with Various Topographies   Compared with traditional coating processes such as spin coating and dip coating, Siansonic ultrasonic coating technology for deposition of photoresist coating onto semiconductors has the advantages of high uniformity, excellence coverage of microstructure and controllable coating area. In the past 10 years, it has been fully proved that the photoresist coating on the surface of 3D microstructure by ultrasonic coating technology is significantly higher than the traditional spin coating process in terms of encapsulation and uniformity of microstructure. Siansonic ultrasonic coating systems can be used for surface coatings of planar and 3D structural substrates including silicon wafer, glass, ceramics, metal and other materials. Typical photoresist coating applications include silicon wafers, MEMS, lens, microfluidic chips, filters, etc. Ultrasonic coating is a simple, effective, econo...